What’s SMT ?

What’s Most Important in SMT filed ?

Why still a lot of defective products in line or after few weeks ?

Why Japanese products have a good quality in Electronic fields ?

A lot of Knowledge of Robotics , industrial ,Design ,production , tests , Quality needs to become together to make a new products with a best quality ?

When you deiced to make a new Electric bikes , Electric car , everything’s need your engineers knowledge and experiences ,only Knowledge and update doesn’t enough .Real time control .Teaching Staff and a lot of elements needs to bring a high quality and long term brand to your company .

Just SMT , Just Assembly ! it’s nothing .

Do you love your JOB , we think it’s the first and most Important Element that bring all good things to you .

Some management system ISO and Six Sigma , 5S , 6 S ,TS just manage your system, these system just show you which way is better or what you should do .Are you really think that’s enough ?

A lot of company can pay and buy some licence and some of them should check every period of time , that means still some body should check system again .

As we love our Job ,we will do it ,we check it again everything’s ,we Manage ourselves .What about you ? Do you still need some body manage you ?

let -japtec- doing your SMT without any defective
Before Start to know about SMT and lot of Question about Quality let’s try to study about some special words , we will try to up date this page as SMT reference or Hand book page ,

in another mean a Big Dictionary with a lot of experiences of SMT and DIP filed.(write by Zandi )

  • ASIC =Application-Specific integrated circuit.
  • BGA= Ball grid array ;A plastic or ceramic body Containing an IC, with its IOs,in the form of solder bumps ,located on its underside.
  • CC=Chip-carrier:A square-bodied,plastic or ceramic SMD,with an IC inside.
  • Chip=The term Chip has acquired several meanings,among them the following :an IC on a ceramic substrate;an SMD which contains an IC :a resistor or ceramic capacitor,encased in rectangular ceramic body.Unless expressly stated, the term ‘Chip’will always have this last meaning in this site.
  • COB=Chip-On-Board: a bare chip , glued to a board and connected to its circuitry by wire bonding.
  • CSP=Chip-size package:an SMD with a plastic or ceramic body which is not much larger than the chip which it contains.
  • DCA=Direct Chip attached(an alternative name for flip chip).
  • DIL=Dual-in-Line; a through-mounted device (TMD) containing an integrated circuit with two parallel lines of legs.
  • FP=Flip Chip: a bare chip with solder-bumps on its underside.Like a BGA, it can be re flow soldered directly to a circuit board.
  • IC=Integrated circuit:an electronic circuit carried on the surface of a silicon wafer.
  • I/O,IO=In/Out: the Solder able connectors or leads of an SMD.
  • MCM=Multi-Chip module: and array of interconnected ICs,Mounted on a common substrate, such as a multi-layer PCB,or  a silicon , ceramic or glass wafer,to be soldered to a circuit board .
  • Melf=A Metal electrode face-bonded component: a resistor or a diode, encased in a cylindrical ceramic body with metallized solder-able ends.
  • PCB=Printed circuit board.
  • PLCC=Plastic leaded chip carrier: a CC with a body made of plastic,with J-Shaped legs on all four sides.
  • QFP=Quad flat pack:a plastic body containing an IC, with gull-wing legs on all four sides.
  • SMD=A surface mounted device.
  • SO=Small outline; An SMD , with a plastic body, carrying gull-wing legs on opposite sides.
  • SOIC=An So, with and IC( Usually with a 1.25 mm/50mil pitch)
  • SOT=An SO transistor
  • TMD=Through-mounted device : a component with connecting wires or legs, which are inserted into the through-plated holes of a circuit board.
  • VSOIC=Very small outline: A fine-pitch SOIC

Everywhere , any company can buy a Full SMT line .But Can they Produce non NG products ?

Why Temp Profile so Important ?

What’s the Temp profile Sensors ?

What’s Temperature cycle test ?

  • Japtec will conduct a test to check the products withstand capacity in an environment repeating high to low temperature.
  • Temp Cycle test , cold shock/heat cycle test .
  • In the temperature cycle (TEMP CYCLE) test on reliability, by repeatedly alternating high and low temperatures, stress on temperature change is applied to electronic parts, causing failure in a short time compared to under actual use environment.
    as a failure example, package crack, wire break short, and such as the inside of the package peeling failure will be raised as a failure example.
  • Reference test Standard in JAPAN :  JEDEC ( JESD 22-A 104) / JEITA ( EIAJ ED- 4701/105 ).
  • Test Equipment :
Device name Maker Model number Device capability In-tank size (W x D x H)
Cold thermal shock device
TSA-71S-W ~ 0 ℃ -70
Tasu 60 ~ Tasu 200 ℃
410 x 370 x 460 mm
TSA – 73 ES – W ~ 0 ℃ -70
Tasu 60 ~ Tasu 200 ℃
410 x 370 x 460 mm
TSA-101S-W ~ 0 ℃ -70
Tasu 60 ~ Tasu 200 ℃
650 x 370 x 460 mm
TSA-201S-W ~ 0 ℃ -70
Tasu 60 ~ Tasu 200 ℃
650 x 670 x 460 mm
TSA-203 ES-W ~ 0 ℃ -70
Tasu 60 ~ Tasu 200 ℃
650 x 670 x 460 mm
HITACHI ES-106L ~ 0 ℃ -65
Tasu 60 ~ Tasu 200 ℃
550 x 530 x 450 mm
  •  A lot of Tester machine in japan as Hitachi / ESPEC and etc.
  • Also a lot of VC( Visual Checker ) On line or Off line

japtec-innovation-pcb-design-SMT -Japtec

Do you know about ESD-CDM test ?

Charged Device Model

  • ESD-CDM tests up to 1024 pins and ± 4000 V can be performed.
  • ESD-CDM test service is also possible to cope with “AEC Q100-011” of automotive products for the standard
  • The ESD-CDM (Charged Device Model) test is a reliability test assuming a discharge model when the electrode of an electronic part charged with static electricity contacts an external conductor.
  • JEDEC · (JESD22-C103) / JEITA (EIAJ ED-4701/305)
    board articles for the standard “AEC Q100-011” (D-CDM, FI-CDM )
  • CDM Tester   Maximum applied Voltage +/- 4000 Volt

Did you Finished Electrostatic Discharge Sensitivity Test ?

  • ESD Tester  Maximum applied Voltage +/- 8000 Voltage Human body Method

Did you arrange Temperature and Humidity Cycle test ?

  • The temperature and humidity cycle test, the product is high temperature, low temperature, high humidity, low humidity environment to repeat the
    thing, is the semiconductor reliability environmental testing be done to confirm the problem to occur.